QK Soft

Sign-off Solutions for EM/IR in Digital IC Design

Chipoly™ is a next-generation tool for reliability signoff, not only supporting advanced processes below 7nm, but also compatible with mature node. Chipoly™ revolutionizes reliability simulation with a novel approach, delivering precise result (such as EM, IR-Drop and Power) for various modes and scenarios under specific requirements. It attains SPICE-level accuracy with runtime far better than traditional signoff tools.

Quick Specs


Signal EM
Power EM/IR-Drop
Instantaneous Feedback on IR ECO
Dynamic & Static Power
Statistical EM Budgeting​
Chip Power Modeling​
Product Advantages​


Chipoly implements a unique simulation approach, distinct from conventional tools, enabling swift and precise simulation of a chip’s global current response curve. This affords accurate reliability metrics like EM (Electromigration) and IR (Voltage Drop), alongside other essential power-related parameters.

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